EMLC 2007 (23rd European Mask and Lithography Conference)Behringer, Uwe F.W; Maurer, Wilhelm; Waelpoel, Jacques et al.Proceedings of SPIE, the International Society for Optical Engineering. 2007, issn 0277-786X, isbn 978-0-8194-6655-6, 1 v. (various pagings), isbn 978-0-8194-6655-6Conference Proceedings

MAM2009: A single-session Workshop devoted to Materials Research, Materials Properties and Interactions: Proceedings of the Eighteenth European Workshop on Materials for Advanced Metallization 2009CHEVOLLEAU, Thierry; CHENEVIER, Bernard; LARTIGUE, Colette et al.Microelectronic engineering. 2010, Vol 87, Num 3, issn 0167-9317, 294 p.Conference Proceedings

Impact of the CMP process on the electrical properties of ultra low k porous SiOCHDUBOIS, C; SYLVESTRE, A; CHAABOUNI, H et al.Microelectronic engineering. 2010, Vol 87, Num 3, pp 333-336, issn 0167-9317, 4 p.Conference Paper

The influence of ultrasonic agitation on copper electroplating of blind-vias for SOI three-dimensional integrationQIANWEN CHEN; ZHEYAO WANG; JIAN CAI et al.Microelectronic engineering. 2010, Vol 87, Num 3, pp 527-531, issn 0167-9317, 5 p.Conference Paper

Accelerating physical verification-using STPRL : a novel language for test pattern generationNOUH, Ahmed.Proceedings of SPIE, the International Society for Optical Engineering. 2007, pp 65331I.1-65331I.6, issn 0277-786X, isbn 978-0-8194-6655-6Conference Paper

Fast near field simulation of optical and EUV masks using the waveguide methodEVANSCHITZKY, Peter; ERDMANN, Andreas.Proceedings of SPIE, the International Society for Optical Engineering. 2007, pp 65330Y.1-65330Y.12, issn 0277-786X, isbn 978-0-8194-6655-6Conference Paper

An innovative NEMS pressure sensor approach based on heterostructure nanowireXU, X; BERCU, B; LIME, F et al.Microelectronic engineering. 2010, Vol 87, Num 3, pp 406-411, issn 0167-9317, 6 p.Conference Paper

Evaluation of a novel unfluorinated copper precursor for chemical vapor depositionHAIZHENG SONG; NORMAN, John A. T; SHIMOGAKI, Yukihiro et al.Microelectronic engineering. 2010, Vol 87, Num 3, pp 249-253, issn 0167-9317, 5 p.Conference Paper

Mapping of elastic modulus at sub-micrometer scale with acoustic contact resonance AFMMEGE, F; VOLPI, F; VERDIER, M et al.Microelectronic engineering. 2010, Vol 87, Num 3, pp 416-420, issn 0167-9317, 5 p.Conference Paper

Effects of heat curing on adhesive strength between microsized SU-8 and Si substrateISHIYAMA, C; SONE, M; HIGO, Y et al.Proceedings of SPIE, the International Society for Optical Engineering. 2007, pp 65331F.1-65331F.8, issn 0277-786X, isbn 978-0-8194-6655-6Conference Paper

Deposition and characterization of electroless Ni-Co-P alloy for diffusion barrier applicationsKUMAR, Anuj; KUMAR, Mukesh; KUMAR, Dinesh et al.Microelectronic engineering. 2010, Vol 87, Num 3, pp 387-390, issn 0167-9317, 4 p.Conference Paper

Reliability of copper low-k interconnectsTOKEI, Zsolt; CROES, Kristof; BEYER, Gerald P et al.Microelectronic engineering. 2010, Vol 87, Num 3, pp 348-354, issn 0167-9317, 7 p.Conference Paper

Characterization of photo masks by X3D AFMFROECK, C; HO, M.Proceedings of SPIE, the International Society for Optical Engineering. 2007, pp 65330T.1-65330T.9, issn 0277-786X, isbn 978-0-8194-6655-6Conference Paper

Focused electron beam induced deposition of DUV transparent SiO₂PERENTES, Alexandre; HOFFMANN, Patrik; MUNNIK, Frans et al.Proceedings of SPIE, the International Society for Optical Engineering. 2007, pp 65331.Q.1-65331Q.9, issn 0277-786X, isbn 978-0-8194-6655-6Conference Paper

Mask industry assessment trend analysis 2006SHELDEN, Gilbert; MANNILLION, Patricia.Proceedings of SPIE, the International Society for Optical Engineering. 2007, pp 653303.1-653303.10, issn 0277-786X, isbn 978-0-8194-6655-6Conference Paper

Time resolved evolution of the etch biasNESLADEK, Pavel; PAUL, Jan.Proceedings of SPIE, the International Society for Optical Engineering. 2007, pp 65330D.1-65330D.9, issn 0277-786X, isbn 978-0-8194-6655-6Conference Paper

Bottom-up copper electroplating using transfer wafers for fabrication of high aspect-ratio through-silicon-viasCHONGSHEN SONG; ZHEYAO WANG; LITIAN LIU et al.Microelectronic engineering. 2010, Vol 87, Num 3, pp 510-513, issn 0167-9317, 4 p.Conference Paper

Bottom-up filling optimization for efficient TSV metallizationDELBOS, Elise; OMNES, Laurent; ETCHEBERRY, Arnaud et al.Microelectronic engineering. 2010, Vol 87, Num 3, pp 514-516, issn 0167-9317, 3 p.Conference Paper

Contact angles and liquid loss behavior of high index fluidsHARDER, Paul M; SHEDD, Timothy A.Proceedings of SPIE, the International Society for Optical Engineering. 2007, pp 653305.1-653305.12, issn 0277-786X, isbn 978-0-8194-6655-6Conference Paper

Studies on aluminium corrosion during and after HF vapour treatmentRITALA, Heini; KIIHAMÄKI, Jyrki; HEIKKILÄ, Mikko et al.Microelectronic engineering. 2010, Vol 87, Num 3, pp 501-504, issn 0167-9317, 4 p.Conference Paper

The deposition of nanocrystalline TiO₂ thin film on silicon using Sol-Gel technique and its characterizationKUMAR, Mukesh; KUMAR, Mukesh; KUMAR, Mukesh; KUMAR, Mukesh; KUMAR, Dinesh et al.Microelectronic engineering. 2010, Vol 87, Num 3, pp 447-450, issn 0167-9317, 4 p.Conference Paper

A novel model building flow for the simulation of proximity effects of mask processesMAS, Jonathan; MITTERMEIER, Engelbert.Proceedings of SPIE, the International Society for Optical Engineering. 2007, pp 65331N.1-65331N.10, issn 0277-786X, isbn 978-0-8194-6655-6Conference Paper

Mask qualification strategies in a wafer fabJAEHNERT, Carmen; KUNOWSKI, Angela.Proceedings of SPIE, the International Society for Optical Engineering. 2007, pp 65331C.1-65331C.9, issn 0277-786X, isbn 978-0-8194-6655-6Conference Paper

Metrology capabilities and performance of the new DUV Scatterometer of the PTBWURM, Matthias; BODERMANN, Bemd; PILARSKI, Frank et al.Proceedings of SPIE, the International Society for Optical Engineering. 2007, pp 65330H.1-65330H.8, issn 0277-786X, isbn 978-0-8194-6655-6Conference Paper

Role of titanium in Ti/Ni ohmic contact on n-type 6H-SiCMACHAC, Petr; BARDA, Bohumil; KUDRNOVA, Marie et al.Microelectronic engineering. 2010, Vol 87, Num 3, pp 274-277, issn 0167-9317, 4 p.Conference Paper